In 2010, Mica Corporation established the Daniel Siegel Memorial Scholarship fund to honor the memory of Mica’s late founder and to encourage science and engineering students to continue career pursuits in the packaging industry. This $4,000 scholarship is presented at the Technical Association of the Pulp and Paper Industry’s (TAPPI) biennial International Flexible Packaging and Extrusion Division Conference and is awarded to a TAPPI Student Chapter member enrolled in a packaging or related major. The next award will be given in 2022 at TAPPI’s next in-person International Flexible Packaging and Extrusion Division Conference in Austin, Texas.